Patchy particles are formed from the clusters using a two-stage swelling process followed by polymerization 31. First, a low-molecular-mass, water-insoluble organic compound (1-chlorodecane) is ...

A highly versatile deposition process already used to manufacture aircraft parts and other expensive, delicate surfaces is now 3-D modeled to show the effects of temperature for the first time. Cold ...

New research reveals the best way to make metal particles stick to a surface in a spray-coating process. Surprisingly, melting hurts rather than helps. When bonding two pieces of metal, either the ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

With semiconductors, it’s often things everyone takes for granted that cause the biggest headaches, and that problem is compounded when something fundamental changes — such as bonding two chips ...