Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its ...

Joint Development Agreement builds on ongoing collaboration with Manz Asia As demand for AI computing accelerates, advances in 12" wafer-level packaging and large-area panel packaging could offer a ...

TL;DR: NVIDIA's next-generation Rubin AI GPUs, featuring a chiplet design and advanced CoWoS-L packaging on TSMC's N3P node, will enter trial production in September and mass production in early 2026.

As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

In current designs, both the DRAM and the HPB sit on top of the processor. That means the HPB mainly helps cool the CPU and GPU, while the memory — which also heats up under load — doesn’t benefit as ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

SEOUL—A longtime Intel INTC1.49%increase; green up pointing triangle expert in chip packaging who was named its inventor of the year in 2024 has left the U.S. company and taken a job at Samsung’s ...

It has become common practice for AMD and Intel to re-release processors from several generations-old architectures. Japanese news outlet Akiba reports that AMD has relaunched its entry-level ...

The Data Center AI Chip Packaging market is becoming a critical pillar of the global artificial intelligence ecosystem, and ...