Millimeter-wave (mmW) radar is one of the primary sensing modalities for automotive and industrial applications because of its ability to detect objects from a few centimeters to several hundred ...

Scientists at Tokyo Institute of Technology develop a 3D functional interposer--the interface between a chip and the package substrate--containing an embedded capacitor. This compact design saves a ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

In September, Rambus announced the achievement of reaching 4 gigabits per second (Gbps) operation with our HBM2E memory interface. This milestone was demonstrated in silicon and required mastering ...

Intel announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued ...