The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

China's push for semiconductor self-sufficiency has extended to networking infrastructure, with Taiwanese IC design firms ...

Celera Semiconductor, the analog industry leader using AI to automate the entire product development flow, today announced that Dr. Helen Song has joined the company as vice president of Product ...

In any multi-die assembly, stacking two or more active dies results in thermal stress. Heat dissipated from a lower die faces ...

Santa Barbara-based ChipAgents.ai today announced it raised $21M in early funding to fuel growth for its agentic artificial intelligence platform for chip design and verification.

Cadence has completed the acquisition of Secure-IC, a leader in embedded security IP, security solutions and security ...

High-speed transmission IC designer Parade held its earnings call on October 29, 2025, reporting robust customer restocking in the third quarter of 2025. The company posted NT$4.366 billion (US$134 ...

On January 15, 2025, the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) released an interim final rule (IFR) updating export controls on advanced computing semiconductors. This ...