3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by ...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a ...
China's push for semiconductor self-sufficiency has extended to networking infrastructure, with Taiwanese IC design firms ...
Each generation of IC design technology introduces new levels of complexity, and logic verification teams face a host of new challenges due to this dramatic rise in IC design complexity. As a result, ...
Cadence is ushering in “the future for custom analog design” with Virtuoso Studio. The San Jose, California-based company said the new platform takes care of many of the challenges its customers face ...
Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...
Microchip Technology’s MCP3909 energy-measurement IC and the MCP3909 3-Phase Energy Meter Reference Design enable designers to quickly design and develop energy meter designs. The IC combines low ...
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