The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
The motherboard receptacle for Pentium II and III CPUs. Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the ...
Frenchtown, N.J. – Aries Electronics has broadened its line of pin-grid-array zero-insertion-force (ZIF) Test Sockets with a 9 x 9-grid version. The units enable just one socket to handle a full range ...
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