Kemtronics is showing strong performance. Securities firms' analysis that the TGV process business, a core process of glass substrates based on large-area display glass wafer etching technology, will ...

A new process combines two well-known bonding methods, edge folding and ultrasonic welding, to create an optimized procedure for joining decorative materials like vinyl, textiles, or leather to a ...

With the advancement of artificial intelligence (AI) semiconductors, various issues have arisen in packaging, leading to growing interest in glass substrates, which offer significant technological ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.

SEOUL, South Korea--(BUSINESS WIRE)--DB HiTek had announced to expand the RF front-end business by securing RF SOI (Silicon-on-Insulator) and RF HRS (High Resistivity Substrate) process based on 130nm ...

NEC Corp. and NEC Electronics Ltd. Wednesday introduced a Multi-layer Thin Substrate (MLTS) and corresponding chip-scale package that the company said is smaller than CSP types now used. NEC said it ...

Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...

Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...

Backed by state subsidies and a self-sufficient supply chain, China is ramping up SiC substrate and mature process chip production at an unprecedented pace. The expansion is fueling fears of a global ...

Compare 3 process flows in terms of robustness to process variation to see which one has the lowest likelihood of processing failures. Sub-5 nm logic nodes will require an extremely high level of ...