Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, ...

An optical method for mask alignment in double-sided lithography has been developed by a team at the University of Hagen in Germany (Appl. Opt. 40 5052). The technique, which is based on the ...

Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and ...